The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Mar. 25, 2008
Ryoji Matsuoka, Aichi-ken, JP;
Muneo Furutani, Aichi-ken, JP;
Masato Nasu, Aichi-ken, JP;
Takeshi Inoue, Aichi-ken, JP;
Ryoji Matsuoka, Aichi-ken, JP;
Muneo Furutani, Aichi-ken, JP;
Masato Nasu, Aichi-ken, JP;
Takeshi Inoue, Aichi-ken, JP;
Toyoda Gosei Co., Ltd., Aichi-pref., JP;
Abstract
A bumper molding is fabricated by disposing segmented anodesandon surfacesandof a base material, which are to be plated, and performing electroplating so as to form metal films on the surfacesand, respectively. The curvature of a surface of a concave portion, which is formed in each part of the surfacesandso that the surface of the concave portion is away from the segmented anodesand, respectively, is larger than those of other portions at a part serving as a border between the second plated surfaceand the fourth plated surface. Accordingly, the distance from the part serving as the border between the second plated surfaceand the fourth plated surfaceto a metal casecorresponding to this part is set so as to be shorter than those from each of the other parts to the metal casesandrespectively corresponding to the segmented anodesand