The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Dec. 06, 2007
Takahiro Tomita, Chita, JP;
Kenji Morimoto, Kasugai, JP;
Katsuhiro Inoue, Ama-County, JP;
Masaaki Kawai, Nishikasugai-County, JP;
Suguru Kodama, Nagoya, JP;
Takahiro Tomita, Chita, JP;
Kenji Morimoto, Kasugai, JP;
Katsuhiro Inoue, Ama-County, JP;
Masaaki Kawai, Nishikasugai-County, JP;
Suguru Kodama, Nagoya, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
There is provided a bonding material composition for obtaining a joined body by unitarily joining two or more members to be joined by means of a bonding material layer, wherein the bonding material composition contains flat particles, non-flat particles, smectite-based clay, and an inorganic adhesive as main components. The bonding material composition costs little, can relax thermal stress generated in the joined body without using fibers which may do harm to a human body, and can reduce defects such as a crack and a void upon drying or a thermal treatment.