The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Apr. 27, 2007
Kenichi Beppu, Wakayama, JP;
Kenichi Beppu, Wakayama, JP;
Sumitomo Metal Industries, Ltd., Osaka, JP;
Abstract
A process for manufacturing a seamless tube which can effectively suppress thickness deviations which are apt to occur in thin-walled seamless tubes is provided. A billet which has been soaked in a heating furnace at a given temperature for a given length of time is subjected to piercing and elongation rolling to form a mother tube, which is then soaked in a reheating furnace at a given temperature for a given length of time and then subjected to sizing to produce a seamless tube with a wall thickness of at most 4 mm. The wall thickness of the tube after sizing is at most 4 mm, the soaking time at the given temperature in the heating furnace is in the range of [billet diameter (mm)×(from 0.14-0.35 )] minutes, and the soaking time at the given temperature in the reheating furnace is in the range of [mother tube wall thickness (mm)×(from 3.0-10.0)] minutes.