The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2012
Filed:
Dec. 19, 2007
Hyun-seok Choi, Cheonan-si, KR;
Yong-hyun Kim, Suwon-si, KR;
Jung-chan Cho, Ssangyong-dong, KR;
Hyung-mo Hwang, Ssangyong-dong, KR;
Hyun-Seok Choi, Cheonan-si, KR;
Yong-Hyun Kim, Suwon-si, KR;
Jung-Chan Cho, Ssangyong-dong, KR;
Hyung-Mo Hwang, Ssangyong-dong, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor memory module includes a printed circuit board (PCB) including a rigid PCB part and a flexible PCB part including an overlap portion, a non-overlap portion, and memory components mounted on the PCB. The rigid PCB part includes a first surface and a second surface facing the first surface. The overlap portion of the flexible PCB part overlaps the rigid PCB part, and the non-overlap portion does not overlap the rigid PCB part. The flexible PCB part may include an overlap stacked structure including at least one doubling portion.