The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2012
Filed:
Sep. 26, 2008
Applicant:
Noriyuki Nagai, Nara, JP;
Inventor:
Noriyuki Nagai, Nara, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/485 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
The bump electrodeof the present invention has a structure in which dummy metalsare provided in the uppermost layer portion of a siliconbetween a pad-form wiring metaland a wiring metalsuch that an edge of each dummy metal and an edge of the barrier metalare not aligned in a line, and a lot of interfaces are formed between the dummy metalsand an interlayer film, and therefore expansion of a crack generated due to bump stress concentrated on the under-edge portionbelow the barrier metalbetween the pad-form wiring metaland the wiring metalis suppressed.