The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2012

Filed:

Oct. 09, 2005
Applicants:

Zhengyu Shi, Shanghai, CN;

Limin Wang, Shanghai, CN;

Lei Shi, Shanghai, CN;

Inventors:

Zhengyu Shi, Shanghai, CN;

Limin Wang, Shanghai, CN;

Lei Shi, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A TSOP (Thin Small Outline Package) contains a MOSFET and a Schottky diode. The MOSFET has a source terminal a gate terminal and a drain terminal. The Schottky diode has a cathode terminal, a anode terminal. The TSOP contains the MOSFET and the Schottky diode with a special configuration by placing the drain terminal of the MOSFET and the anode terminal of the Schottky diode on a same side. Specifically, the TSOP implements a leadframe that comprises a plurality of leads. The drain terminal of the MOSFET and the anode terminal extends outside of the TSOP separate on the same side of the package.


Find Patent Forward Citations

Shi, Zhengyu. (2012). Small outline package in which mosfet and schottky diode being co-packaged (U.S. Patent No. 8089139). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8089139

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…