The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2012
Filed:
Jun. 25, 2009
Seung Jin Yeom, Gyeonggi-do, KR;
Jae Hong Kim, Gyeonggi-do, KR;
Sung Goon Kang, Seoul, KR;
Won Kyu Han, Seoul, KR;
Seung Jin Yeom, Gyeonggi-do, KR;
Jae Hong Kim, Gyeonggi-do, KR;
Sung Goon Kang, Seoul, KR;
Won Kyu Han, Seoul, KR;
Hynix Semiconductor Inc., Gyeonggi-do, KR;
IUCF-HYU (Industry-University Cooperation Foundation Hanyang University), Seoul, KR;
Abstract
A copper line having self assembled monolayer for use in ULSI semiconductor devices and methods of making the same are presented. The copper line includes an interlayer dielectric, a self-assembled monolayer, catalytic particles on the monolayer, and a copper layer on the monolayer with the catalytic particles. The method includes the steps of forming an interlayer dielectric on a semiconductor substrate having a metal line forming region; forming a self-assembled monolayer on the metal line forming region; adsorbing catalytic particles on the self-assembled monolayer; forming using an electroless process a copper seed layer on the self-assembled monolayer having the catalytic particles adsorbed thereto; and forming a copper layer on the copper seed layer to fill in the metal line forming region.