The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2012

Filed:

Jan. 30, 2009
Applicants:

Mariappan Parans Paranthaman, Knoxville, TN (US);

Srivatsan Sathyamurthy, Knoxville, TN (US);

Tolga Aytug, Knoxville, TN (US);

Paul N Arendt, Los Alamos, NM (US);

Liliana Stan, Los Alamos, NM (US);

Stephen R Foltyn, Los Alamos, NM (US);

Inventors:

Mariappan Parans Paranthaman, Knoxville, TN (US);

Srivatsan Sathyamurthy, Knoxville, TN (US);

Tolga Aytug, Knoxville, TN (US);

Paul N Arendt, Los Alamos, NM (US);

Liliana Stan, Los Alamos, NM (US);

Stephen R Foltyn, Los Alamos, NM (US);

Assignees:

UT-Battelle, LLC, Oak Ridge, TN (US);

The Regents of the University of California, Oakland, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 12/00 (2006.01); B05D 5/12 (2006.01); H01L 39/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

A superconducting article includes a substrate having an untextured metal surface; an untextured barrier layer of LaZrOor GdZrOsupported by and in contact with the surface of the substrate; a biaxially textured buffer layer supported by the untextured barrier layer; and a biaxially textured superconducting layer supported by the biaxially textured buffer layer. Moreover, a method of forming a buffer layer on a metal substrate includes the steps of: providing a substrate having an untextured metal surface; coating the surface of the substrate with a barrier layer precursor; converting the precursor to an untextured barrier layer; and depositing a biaxially textured buffer layer above and supported by the untextured barrier layer.


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