The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8088307 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 03, 2012

Filed:

May. 25, 2007
Applicants:

Soon Yeong Heo, Daegu, KR;

Seong Sil Park, Daegu, KR;

Seung Jun Han, Kyungsangnam-do, KR;

Hyun Myung Jang, Pohang-si, KR;

Inventors:

Soon Yeong Heo, Daegu, KR;

Seong Sil Park, Daegu, KR;

Seung Jun Han, Kyungsangnam-do, KR;

Hyun Myung Jang, Pohang-si, KR;

Assignee:

Exax Inc., Gumi-Si, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a metal paste for forming an electrically conductive layer comprising a metal solution in a reactive organic solvent having a heteroatom P, S, O, or N; metal powder; a binder; and a residual amount of a polar or non-polar viscosity modulating solvent. The metal paste composition according to the present invention has advantages in that it produces structures of layers denser than those conventional metal pastes do; shows characteristics of a much lower electric resistance even with a relatively small thickness or a small line width, as compared with the conductive pattern formed from a conventional paste; and allows heat treatment at a very low temperature even without the use of expensive nano-sized metal particles. The metal paste also provides a silver paste, which can be economically prepared and has high adaptability to various surfaces.


Find Patent Forward Citations

Heo, Soon. (2012). Metal paste for forming a conductive layer (U.S. Patent No. 8088307). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8088307

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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