The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2012
Filed:
May. 06, 2011
Frank Edward Anderson, Sadieville, KY (US);
David Laurier Bernard, Lexington, KY (US);
Paul William Dryer, Lexington, KY (US);
Burton Lee Joyner, Ii, Lexington, KY (US);
Andrew Lee Mcnees, Lexington, KY (US);
Timothy Lowell Strunk, Georgetown, KY (US);
Carl Edmond Sullivan, Stamping Ground, KY (US);
Frank Edward Anderson, Sadieville, KY (US);
David Laurier Bernard, Lexington, KY (US);
Paul William Dryer, Lexington, KY (US);
Burton Lee Joyner, II, Lexington, KY (US);
Andrew Lee McNees, Lexington, KY (US);
Timothy Lowell Strunk, Georgetown, KY (US);
Carl Edmond Sullivan, Stamping Ground, KY (US);
Lexmark International, Inc., Lexington, KY (US);
Abstract
A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.