The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2011
Filed:
Sep. 10, 2008
Applicants:
Michinari Tetani, Osaka, JP;
Minoru Fujisaku, Kyoto, JP;
Inventors:
Michinari Tetani, Osaka, JP;
Minoru Fujisaku, Kyoto, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a wafer level CSP package, with respect to signal wiringdisposed in a signal wiring disposition forbidden regionin the vicinity of external output terminals disposed in a package outer peripheral portion, since a stress generated at signal wiringcan be dispersed by disposing dummy wiringaround the signal wiringor by expanding the width of the signal wiring itself, occurrences of cracks in a surface protective film can be readily suppressed.