The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2011
Filed:
Jul. 24, 2009
Seung-woo Shin, Suwon-si, KR;
Seung-woo Shin, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
According to an example embodiment, a semiconductor chip package includes a substrate comprising a substrate body having a first main surface, a second main surface, and a cavity that defines an opening in the first main surface, and a layer of electrically conductive material integral with the substrate body. The layer of electrically conductive material constitutes an interconnection pattern of the substrate. The semiconductor chip packages further includes a semiconductor chip disposed within the cavity and mounted to the substrate. The chip includes electrical contacts in the form of pads and the pads face in a direction towards the bottom of the cavity such that the chip has a flip-chip orientation with respect to the substrate. The pads are electrically conductively bonded to respective portions of the interconnection pattern.