The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2011

Filed:

Oct. 01, 2009
Applicants:

Ho Sun Paek, Gyunggi-do, KR;

Hak Hwan Kim, Gyunggi-do, KR;

Young Jin Lee, Seoul, KR;

Hyung Kun Kim, Gyunggi-do, KR;

Suk Ho Jung, Gyunggi-do, KR;

Inventors:

Ho Sun Paek, Gyunggi-do, KR;

Hak Hwan Kim, Gyunggi-do, KR;

Young Jin Lee, Seoul, KR;

Hyung Kun Kim, Gyunggi-do, KR;

Suk Ho Jung, Gyunggi-do, KR;

Assignee:

Samsung LED Co., Ltd., Gyunggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.


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