The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8084519 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 27, 2011

Filed:

Sep. 28, 2009
Applicants:

Tsubasa Okuno, Hiratsuka, JP;

Nao Sato, Hiratsuka, JP;

Kazunori Ishikawa, Hiratsuka, JP;

Inventors:

Tsubasa Okuno, Hiratsuka, JP;

Nao Sato, Hiratsuka, JP;

Kazunori Ishikawa, Hiratsuka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/66 (2006.01); C08G 59/68 (2006.01);
U.S. Cl.
CPC ...
Abstract

A curing accelerator for epoxy resin compositions, which is used in a one-pack type epoxy resin composition having excellent storage stability and rapid curability. The curing accelerator for epoxy resin compositions contains a microcapsule type curing accelerator wherein a compound represented by formula (I) is encapsulated by a thermosetting resin. (In formula (I), Rand Reach represents a hydrogen atom or an alkyl group.)


Find Patent Forward Citations

Okuno, Tsubasa. (2011). Curing accelerator for epoxy resin composition, and one-pack type thermosetting epoxy resin composition (U.S. Patent No. 8084519). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8084519

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