The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2011
Filed:
Apr. 01, 2010
Applicant:
Dae JO Hong, Gyeongsangnam-do, KR;
Inventor:
Dae Jo Hong, Gyeongsangnam-do, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyunggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a method for forming post bumps, the method including the steps of: forming a seed layer for metal plating on a substrate; forming a resist layer having openings provided as positions where the seed layer is subjected to metal plating; forming a dummy sheet, exposing the openings, on the resist layer; forming a post by performing metal plating of the openings; forming solder balls on the post; and removing the dummy sheet and the resist layer.