The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2011
Filed:
Dec. 18, 2008
Shinji Tanaka, Hokkaido, JP;
Mamoru Mizusawa, Hokkaido, JP;
Hitohisa Yamada, Hokkaido, JP;
The Japan Steel Works Ltd., Tokyo, JP;
Abstract
An object of the invention is to make it possible to produce a copper alloy in which the S content is reduced with no contamination with Al, which has a good casting surface and good internal properties and in which eutectic compounds are refined. The invention relates to a slag for electroslag remelting for copper alloy, including CaF: 20 to 45% by mass, CaO: 10 to 30% by mass, SiO: 10 to 30% by mass, LiF: 10 to 20% by mass, and ZrO: 5 to 15% by mass with other impurities: at most 1% by mass, and satisfying a formula:17.0(LiF content+ZrOcontent)−556≦CaFcontent≦4.1(LiF content+ZrOcontent)−80.9,and the invention relates to a method for producing a copper alloy with the slag.