The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8083162 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 27, 2011

Filed:

Jul. 10, 2008
Applicants:

William S. Henry, Moorestown, NJ (US);

Edwin B. Fay, Cinnaminson, NJ (US);

Ronald R. Warnecke, Idaho Falls, ID (US);

Gary L. Palmer, Shelley, ID (US);

Inventors:

William S. Henry, Moorestown, NJ (US);

Edwin B. Fay, Cinnaminson, NJ (US);

Ronald R. Warnecke, Idaho Falls, ID (US);

Gary L. Palmer, Shelley, ID (US);

Assignees:

LiquaJet L.L.C., Moorestown, NJ (US);

Nitrocision L.L.C., Idaho Falls, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B02C 19/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and system are provided herein for forming microparticles from plastic and elastomeric materials that cannot be reduced in size by conventional methods. The system includes a high-pressure liquid nitrogen energy source, a feeder for providing a preferred constant and uninterrupted feed to a mill, a preferred integral injection device to meter the feed into a chamber for milling and/or classification, and a preferred exhaust system for collection of the milled product.


Find Patent Forward Citations

Quick Actions:

Henry, William. (2011). Method for micro-sizing organic, inorganic and engineered compounds (U.S. Patent No. 8083162). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8083162

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…