The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8080740 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 20, 2011

Filed:

Jan. 23, 2009
Applicants:

Mitsuru Honjo, Ibaraki, JP;

Toshiki Naitou, Ibaraki, JP;

Katsutoshi Kamei, Ibaraki, JP;

Inventors:

Mitsuru Honjo, Ibaraki, JP;

Toshiki Naitou, Ibaraki, JP;

Katsutoshi Kamei, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insulating layer so as to be positioned above the wiring trace. Moreover, a third insulating layer is formed on the second insulating layer so as to cover the ground layer. A read wiring trace is formed on the third insulating layer. A fourth insulating layer is formed on the third insulating layer so as to cover the wiring trace.


Find Patent Forward Citations

Honjo, Mitsuru. (2011). Printed circuit board and method of manufacturing the same (U.S. Patent No. 8080740). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8080740

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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