The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8080505 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 20, 2011

Filed:

Jun. 08, 2009
Applicants:

Didem Ernur, Leuven, BE;

Valentina Terzieva, Bertem, BE;

Jörg Schuhmacher, Grez Doiceau, BE;

Inventors:

Didem Ernur, Leuven, BE;

Valentina Terzieva, Bertem, BE;

Jörg Schuhmacher, Grez Doiceau, BE;

Assignee:

IMEC, Leuven, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is related to a slurry composition for polishing copper integrated with tungsten containing barrier layers and its use in a CMP method. The present invention is also related to a method for polishing copper integrated with tungsten containing barrier layers by means of an aqueous solution containing abrasive particles, an inorganic acid such as HNOas etchant for copper that prevents galvanic corrosion of the tungsten containing metal barrier and at least one organic compound to provide sufficient copper corrosion inhibition.


Find Patent Forward Citations

Ernur, Didem. (2011). Slurry composition and method for chemical mechanical polishing of copper integrated with tungsten based barrier metals (U.S. Patent No. 8080505). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8080505

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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