The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2011
Filed:
Mar. 17, 2009
Toshiyuki Iwanaga, Sabae, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Kenichi Kawasaki, Echizen, JP;
Shunsuke Takeuchi, Echizen, JP;
Seiichi Nishihara, Kameoka, JP;
Shuji Matsumoto, Omihachiman, JP;
Toshiyuki Iwanaga, Sabae, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Kenichi Kawasaki, Echizen, JP;
Shunsuke Takeuchi, Echizen, JP;
Seiichi Nishihara, Kameoka, JP;
Shuji Matsumoto, Omihachiman, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.