The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2011

Filed:

Nov. 14, 2008
Applicants:

Hidetaka Okada, Kyoto, JP;

Yasuhisa Kageyama, Kyoto, JP;

Shun Momose, Kyoto, JP;

Youichi Aoki, Kyoto, JP;

Inventors:

Hidetaka Okada, Kyoto, JP;

Yasuhisa Kageyama, Kyoto, JP;

Shun Momose, Kyoto, JP;

Youichi Aoki, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); G01N 1/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a microchip which is made by bonding a first substrate having a groove provided at the substrate surface and a second substrate together, and has a fluid circuit therein, the fluid circuit having a separation portion for separating a first component, and a groove which constitutes the separation portion including an approximately V-shaped region surrounded by prescribed flow channel walls. At a top of the separation portion, a flow rate limiting portion limiting a flow rate of a fluid is preferably provided.


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