The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2011

Filed:

Oct. 20, 2006
Applicants:

Takafumi Kawasaki, Chiyoda-ku, JP;

Seiichi Mimura, Chiyoda-ku, JP;

Hirokazu Nishida, Chiyoda-ku, JP;

Yasuhiro Yoshida, Chiyoda-ku, JP;

Inventors:

Takafumi Kawasaki, Chiyoda-ku, JP;

Seiichi Mimura, Chiyoda-ku, JP;

Hirokazu Nishida, Chiyoda-ku, JP;

Yasuhiro Yoshida, Chiyoda-ku, JP;

Assignee:

Mitsubishi Electric Corporation, Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 3/02 (2006.01); C09C 1/68 (2006.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to 55% by mass, based on a total mass of components of the slurry excluding the abrasive powder.


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