The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2011

Filed:

Jan. 22, 2009
Applicants:

Ladislav Marek, Lanskroun, CZ;

Stanislav Zednicek, Lanskroun, CZ;

Jaroslav Tomasko, Lanskroun, CZ;

Jiri Navratil, Veseli nad Moravou, CZ;

Inventors:

Ladislav Marek, Lanskroun, CZ;

Stanislav Zednicek, Lanskroun, CZ;

Jaroslav Tomasko, Lanskroun, CZ;

Jiri Navratil, Veseli nad Moravou, CZ;

Assignee:

AVX Corporation, Myrtle Beach, SC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A surface-mountable electrolytic capacitor with improved volumetric efficiency includes an electrolytic capacitor element, anode and cathode terminations, an encapsulation material and external terminations. The capacitor element has first and second opposing end surfaces and an anode wire extending from the first end surface that is electrically connected to a first anode termination portion. A first cathode termination portion is conductively adhered to a surface of the capacitor element, and a second portion is perpendicular to the first portion and parallel to the second end surface of the capacitor element. Encapsulating material surrounds the capacitor element to form a device package that is subsequently diced to improve volumetric efficiency and optionally expose the anode and cathode terminations on opposing end surfaces. First and second external terminations may be formed over the exposed portions of anode and cathode terminations to wrap around to one or more given surfaces of the device package.


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