The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2011
Filed:
Aug. 25, 2008
John David Helfinstine, Big Flats, NY (US);
Robert a Mcintosh, San Antonio, TX (US);
Lisa M Noni, Horseheads, NY (US);
Zhiqiang Shi, Painted Post, NY (US);
Sujanto Widjaja, Corning, NY (US);
David John Worthey, Elmira, NY (US);
John David Helfinstine, Big Flats, NY (US);
Robert A McIntosh, San Antonio, TX (US);
Lisa M Noni, Horseheads, NY (US);
Zhiqiang Shi, Painted Post, NY (US);
Sujanto Widjaja, Corning, NY (US);
David John Worthey, Elmira, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
Systems () and methods for measuring and displaying a visual and/or graphical representation of the specific modulus (E/ρ) of a cellular ceramic body (), such as those used to form particulate filters, are disclosed. The ultrasonic measurement system employs an ultrasonic transmitter (T) and an ultrasonic receiver (R) adjacent to, but spaced apart from respective ends () of the ceramic body. Multiple ultrasonic waves () are sent through corresponding multiple longitudinal portions (P) of the honeycomb structure (), where adjacent longitudinal portions overlap. Time of flight (TOF) measurements (TOF, TOF), along with other parameters describing the ceramic body, allow for the measurement of the sonic speed (c) of the ultrasonic waves that pass through the ceramic body as well as the attenuation (IR). The specific modulus is then calculated from the square of the sonic speed (C). The high resolution of the ultrasonic measurements allows for improved evaluation of the manufacturing process.