The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
May. 28, 2009
Isamu Toba, Tokyo, JP;
Yasuhiro Hasegawa, Tokyo, JP;
Koichi Otani, Tokyo, JP;
Takamitsu Sakamoto, Tokyo, JP;
Isamu Toba, Tokyo, JP;
Yasuhiro Hasegawa, Tokyo, JP;
Koichi Otani, Tokyo, JP;
Takamitsu Sakamoto, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A testing method of a wafer provided with a plurality of thin-film magnetic heads is provided. Each of the plurality of thin-film magnetic heads includes a main pole layer, a first test pad formed on the wafer and electrically connected with an extended top end section of the main pole layer and a second test pad formed on the wafer and electrically connected with a back end section of the main pole layer. The testing method includes a step of measuring an electrical resistance between the first test pad and the second test pad, a step of judging whether the measured electrical resistance is within a set range, and a step of discriminating that the thin-film magnetic head is a non-defective product when the measured electrical resistance is within the set range.