The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Jun. 10, 2005
Tsuyoshi Masuda, Onoda, JP;
Tadaoki Mitani, Nomi, JP;
John Rennie, Komae, JP;
Kounosuke Uozumi, Kanazawa, JP;
Tsuyoshi Masuda, Onoda, JP;
Tadaoki Mitani, Nomi, JP;
John Rennie, Komae, JP;
Kounosuke Uozumi, Kanazawa, JP;
Abstract
An organic semiconductor element part formed on a substrate is covered with a planarizing layer, a radiator plate is fixed with an adhesive layer on the planarizing layer, and a shield layer intercepting the adverse effects exerted on the organic semiconductor element part during the curing of the adhesive layer is formed between the adhesive layer and the planarizing layer. When the adhesive layer is a photo-curing adhesive layer, the shield layer prefers to intercept the light used for curing the photo-curing adhesive layer. When the adhesive layer is a thermosetting adhesive layer, the shield layer prefers to intercept the outgassing occurring during the curing of the thermosetting adhesive layer. By adopting this configuration, it is made possible to accomplish infallible interception of oxygen and moisture and effect radiation of heat with high efficiency. It is further made possible to suppress the adverse effect induced during the adhesion of the radiator plate and prevent the organic semiconductor element part (organic EL element) from being deteriorated.