The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Sep. 15, 2008
Katsumi Kikuchi, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Masaya Kawano, Kawasaki, JP;
Kouji Soejima, Kawasaki, JP;
Katsumi Kikuchi, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Masaya Kawano, Kawasaki, JP;
Kouji Soejima, Kawasaki, JP;
NEC Corporation, Tokyo, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A highly reliable semiconductor device in which connection reliability is assured at very small vias comprises: a semiconductor substrate; a first wiring structure placed on the semiconductor substrate and having one or more first wiring layers, one or more insulating layers and a first via; a second wiring structure placed on the first wiring structure and having one or more second wiring layers, one or more second insulating layers, a second via and a third via; and an external terminal provided on the second wiring structure. The second via, which is connected to the second wiring layer of the second wiring structure and to the external terminal, has a connection interface disposed at an end of the via that is on the side of the external terminal.