The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2011

Filed:

May. 14, 2010
Applicants:

Ki-bum Sung, Daejeon, KR;

Jae-hyun Ahn, Gyeongsangbuk-do, KR;

Seung-sue Kang, Pusan, KR;

Seung-keun Kim, Seoul, KR;

Inventors:

Ki-Bum Sung, Daejeon, KR;

Jae-Hyun Ahn, Gyeongsangbuk-do, KR;

Seung-Sue Kang, Pusan, KR;

Seung-Keun Kim, Seoul, KR;

Assignee:

LG Micron Ltd., Gyeongsangbuk-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A lead frame includes a plurality of leads electrically connected to a semiconductor chip and a lead lock including a base layer disposed over the plurality of the leads and formed of a material having a coefficient of thermal expansion similar to that of inner leads. An adhesive layer is disposed between the base layer and the plurality of leads to fix the plurality of leads and adhere the base layer to the leads. At least one line electrically connects the semiconductor chip to the base layer of the lead lock. Since regions for bus bars are replaced by the lead lock and are removed, the lead frame can be miniaturized and has superior thermal stability and dimension stability.


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