The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Sep. 12, 2005
Peter Flohrs, Reutlingen, DE;
Alfred Goerlach, Kusterdingen, DE;
Peter Urbach, Gomaringen, DE;
Wolfgang Feiler, Reutlingen, DE;
Ning Qu, Reutlingen, DE;
Klaus Heyers, Reutlingen, DE;
Peter Flohrs, Reutlingen, DE;
Alfred Goerlach, Kusterdingen, DE;
Peter Urbach, Gomaringen, DE;
Wolfgang Feiler, Reutlingen, DE;
Ning Qu, Reutlingen, DE;
Klaus Heyers, Reutlingen, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A semiconductor component and a method for manufacturing such a semiconductor component which has a resistance behavior which depends heavily on the temperature. This resistance behavior is obtained by a special multi-layer structure of the semiconductor component, one layer being designed in such a way that, for example, multiple p-doped regions are present in an n-doped region, said regions being short-circuited on one side via a metal-plated layer. For example, the semiconductor component may be used for reducing current peaks, by being integrated into a conductor. In the cold state, the semiconductor component has a high resistance which becomes significantly lower when the semiconductor component is heated as a result of the flowing current.