The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Apr. 19, 2006
Yoshihiko Okajima, Shibukawa, JP;
Katsunori Yashima, Shibukawa, JP;
Keiji Takano, Shibukawa, JP;
Takuya Okada, Shibukawa, JP;
Yoshihiko Okajima, Shibukawa, JP;
Katsunori Yashima, Shibukawa, JP;
Keiji Takano, Shibukawa, JP;
Takuya Okada, Shibukawa, JP;
Denki Kagaku Kogyo Kabushiki Kaisha, Toyko, JP;
Abstract
To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it. A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 μm to 450 μm, each insulating layer is made of a cured product of a resin composition comprising an inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 μm to 300 μm; and a hybrid circuit board employing it.