The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Mar. 16, 2006
Lawrence Frisch, Midland, MI (US);
Maneesh Bahadur, Midland, MI (US);
Ann Norris, Midland, MI (US);
Dow Corning Corporation, Midland, MI (US);
Abstract
A process includes the steps of: 1) heating a mold at a temperature ranging from 100° C. to 200° C.; 2) feeding a silicone encapsulant composition including a mold release agent, where the composition has a viscosity ranging from 100 cps to 3,000 cps at operating temperatures of the process, to an assembly for preventing the silicone encapsulant composition from flowing backward out of the assembly; 3) injecting the silicone encapsulant composition from the assembly into a mold having a horizontal orientation and having a mold cavity through a gate, where the mold cavity has a top and a bottom, a vent is located at the top of the mold cavity, the vent comprises a channel 0.1 mm to 1 mm wide by 0.0001 mm to 0.001 mm deep, the gate is located at the bottom of the mold cavity, and injecting is performed at a pressure ranging from 1,000 psi to 10,000 psi for up to 5 seconds; 4) holding the silicone encapsulant composition at 1,000 psi to 10,000 psi for an amount of time sufficient to prevent the silicone encapsulant composition from flowing out of the mold cavity; 5) curing the product of step 4). Lenses for LED packages may be prepared by the process.