The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Oct. 07, 2008
Keiichi Hatakeyama, Tsukuba, JP;
Yuuki Nakamura, Hitachi, JP;
Keiichi Hatakeyama, Tsukuba, JP;
Yuuki Nakamura, Hitachi, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A method for producing a semiconductor chip with an adhesive film, which includes: preparing a laminate in which a semiconductor wafer, an adhesive film and a dicing tape are laminated in that order, the adhesive film having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load, and the semiconductor wafer having a section, for dividing the semiconductor wafer into a plurality of semiconductor chips, which is formed by irradiating with laser light; dividing the semiconductor wafer into a plurality of semiconductor chips without dividing the adhesive film, by expanding the dicing tape; and dividing the adhesive film by picking up the plurality of semiconductor chips.