The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Nov. 24, 2010
Yin Qian, Milpitas, CA (US);
Hsin-chih Tai, San Jose, CA (US);
Duli Mao, Sunnyvale, CA (US);
Vincent Venezia, Los Gatos, CA (US);
Wei Zheng, Los Gatos, CA (US);
Keh-chiang Ku, Cupertino, CA (US);
Howard E. Rhodes, San Martin, CA (US);
Yin Qian, Milpitas, CA (US);
Hsin-Chih Tai, San Jose, CA (US);
Duli Mao, Sunnyvale, CA (US);
Vincent Venezia, Los Gatos, CA (US);
Wei Zheng, Los Gatos, CA (US);
Keh-Chiang Ku, Cupertino, CA (US);
Howard E. Rhodes, San Martin, CA (US);
OmniVision Technologies, Inc., Santa Clara, CA (US);
Abstract
Embodiments of a method for separating dies from a wafer having first and second sides. The process embodiment includes masking the first side of the wafer, the mask including openings therein to expose parts of the first side substantially aligned with scribe lines of the wafer. The process embodiment also includes etching from the exposed parts of the first side of the wafer until an intermediate position between the first and second sides and sawing the remainder of the wafer, starting from the intermediate position until reaching the second surface.