The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2011

Filed:

Jul. 24, 2009
Applicants:

Atsuki Tsuchiya, Ehime, JP;

Masato Honma, Ehime, JP;

Hideaki Sasaki, Ehime, JP;

Shoji Murai, Nagoya, JP;

Inventors:

Atsuki Tsuchiya, Ehime, JP;

Masato Honma, Ehime, JP;

Hideaki Sasaki, Ehime, JP;

Shoji Murai, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

This invention is A prepreg comprising a reinforcing fiber base material impregnated with a thermoplastic resin, wherein the reinforcing fiber base material comprises from 0 to 50% by mass of reinforcing fibers each having a fiber length of more than 10 mm, from 50 to 100% by mass of reinforcing fibers each having a fiber length of from 2 to 10 mm, and from 0 to 50% by mass of reinforcing fibers each having a fiber length of less than 2 mm, the average of two-dimensional orientation angles each formed by a reinforcing filament (a) and a reinforcing filament (b) intersecting the reinforcing filament (a) is from 10 to 80°, the thickness h0 (mm) at 23° C. is 0.03 to 1 mm, and the tensile strength σ is 0.01 MPa or more. The prepreg can be applied for thin molded products which have been considered unsuitable as a laminated molded product and can provide molded products that have a complicated shape and have isotropically high mechanical properties.


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