The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2011

Filed:

Jun. 06, 2006
Applicants:

Seiji Nakajima, Kyoto, JP;

Tetsuya Mori, Kyoto, JP;

Hidemi Nawafune, Takatsuki, JP;

Inventors:

Seiji Nakajima, Kyoto, JP;

Tetsuya Mori, Kyoto, JP;

Hidemi Nawafune, Takatsuki, JP;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/48 (2006.01); C08F 2/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a metal film and a metal wiring pattern is described a step of forming an organic film by applying and polymerizing an undercoat composition for forming a metal film containing an addition-polymerizable monomer having an acidic group and a polymerization initiator on a substrate or film, a step of converting the acidic group into a metal (M1) salt by treating the organic film with an aqueous solution containing a metal (M1) ion, a step of converting the metal (M1) salt into a metal (M2) salt by treating the organic film with an aqueous solution containing a metal (M2) ion having an ionization tendency lower than the metal (M1) ion, and a step of forming a metal film on the organic film surface by reducing the metal (M2) ion.


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