The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Mar. 24, 2010
Applicants:
Chin-wen Yeh, Taipei Hsien, TW;
Zhi-jian Peng, Shenzhen, CN;
Hai-shan Sun, Shenzhen, CN;
Inventors:
Assignees:
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Hon Hai Precision Industry Co., Ltd., Tu-Cheng, New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/73 (2006.01);
U.S. Cl.
CPC ...
Abstract
A mold assembly includes a mold moving half, at least one heat sink positioned on the mold moving half, and a plurality of heat pipes positioned on the mold fixed half and on the at least one heat sink. The at least one heat sink includes a plurality of parallel fins. The plurality of parallel fins is secured to the heat pipes with the heat pipes passing therethrough. The heat pipes are capable of moving together with the mold moving half.