The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2011

Filed:

May. 28, 2008
Applicants:

Hideki Takehara, Hyogo, JP;

Kazuki Tateoka, Osaka, JP;

Inventors:

Hideki Takehara, Hyogo, JP;

Kazuki Tateoka, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/72 (2006.01);
U.S. Cl.
CPC ...
Abstract

In the present invention, a first circuit patterncomposing a semiconductor element is formed on the front side of a substrate, a first insulating layeris formed on the first circuit pattern, solder electrodesfor external connection are formed on the first insulating layer, a second insulating layeris formed on the backside of the substrate, a second circuit patternis formed on the second insulating layer, through viasare formed to connect the first circuit patternand the second circuit pattern, chip passive componentsare placed on the second circuit pattern, and the backside of the substrate is integrally molded with epoxy resinsuch that the epoxy resincovers the chip passive components


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