The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2011
Filed:
Sep. 05, 2007
Applicants:
Yuh-ren Shieh, Hsinchu, TW;
Hsuan-cheng Fan, Hsinchu, TW;
Jin-ywan Lin, Hsieh, TW;
Cheng-yi Hsu, Hsinchu, TW;
Chung-kuei Huang, Hsinchu, TW;
Inventors:
Yuh-Ren Shieh, Hsinchu, TW;
Hsuan-Cheng Fan, Hsinchu, TW;
Jin-Ywan Lin, Hsieh, TW;
Cheng-Yi Hsu, Hsinchu, TW;
Chung-Kuei Huang, Hsinchu, TW;
Assignee:
Epistar Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract
This invention provides a light-emitting element and the manufacture method thereof. The light-emitting element is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for direct bonding to a submount. Bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device.