The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2011

Filed:

Apr. 18, 2008
Applicants:

Shigeharu Yamagami, Yokohama, JP;

Masakatsu Hoshi, Yokohama, JP;

Tetsuya Hayashi, Yokosuka, JP;

Hideaki Tanaka, Yokohama, JP;

Inventors:

Shigeharu Yamagami, Yokohama, JP;

Masakatsu Hoshi, Yokohama, JP;

Tetsuya Hayashi, Yokosuka, JP;

Hideaki Tanaka, Yokohama, JP;

Assignee:

Nissan Motor Co., Ltd., Yokohama-shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/12 (2006.01); H01L 29/76 (2006.01); H01L 29/78 (2006.01); H01L 21/28 (2006.01); H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of manufacturing a semiconductor device including a semiconductor substrate and a hetero semiconductor region including a semiconductor material having a band gap different from that of the semiconductor substrate and contacting a portion of a first surface of the semiconductor substrate are taught herein, as are the resulting devices. The method comprises depositing a first insulating film on exposed portions of the first surface of the semiconductor substrate and on exposed surfaces of the hetero semiconductor material and forming a second insulating film between the first insulating film and facing surfaces of the semiconductor substrate and the hetero semiconductor region by performing a thermal treatment in an oxidizing atmosphere.


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