The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2011
Filed:
Oct. 04, 2006
Shigeru Tanaka, Settsu, JP;
Kanji Shimoohsako, Settsu, JP;
Takashi Ito, Otsu, JP;
Mutsuaki Murakami, Settsu, JP;
Shigeru Tanaka, Settsu, JP;
Kanji Shimoohsako, Settsu, JP;
Takashi Ito, Otsu, JP;
Mutsuaki Murakami, Settsu, JP;
Kaneka Corporation, Osaka, JP;
Abstract
It is an object of the present invention to provide a thermosetting resin composition having satisfactory adhesiveness, good processability, high heat resistance, and excellent dielectric characteristics in the GHz band; and a laminate and a circuit board including the thermosetting resin composition. The present invention provides a thermosetting resin composition including an imide oligomer component (A) containing at least one imide oligomer having a specific structure and an epoxy resin component (B) containing at least one epoxy resin. Furthermore, the present invention provides the thermosetting resin composition further including a polyimide resin component (C).