The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2011

Filed:

Dec. 23, 2008
Applicants:

Amanda Baer, Campbell, CA (US);

Wen-chien David Hsiao, San Jose, CA (US);

John I. Kim, San Jose, CA (US);

Yinshi Liu, Foster City, CA (US);

Vladimir Nikitin, Campbell, CA (US);

Trevor W. Olson, San Jose, CA (US);

Hicham Moulay Sougrati, Burlingame, CA (US);

Yuan Yao, Fremont, CA (US);

Inventors:

Amanda Baer, Campbell, CA (US);

Wen-Chien David Hsiao, San Jose, CA (US);

John I. Kim, San Jose, CA (US);

Yinshi Liu, Foster City, CA (US);

Vladimir Nikitin, Campbell, CA (US);

Trevor W. Olson, San Jose, CA (US);

Hicham Moulay Sougrati, Burlingame, CA (US);

Yuan Yao, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); B23P 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a magnetic write head having a stepped, recessed, high magnetic moment pole connected with a write pole. The stepped pole structure helps to channel magnetic flux to the write pole without leaking write field to the magnetic medium. This allows the write head to maintain a high write field strength at very small bit sizes. The method includes depositing a dielectric layer and a first CMP layer over substrate that can include a magnetic shaping layer. A mask is formed over the dielectric layer, the mask having an opening to define the stepped pole structure. The image of the mask is transferred into the dielectric layer. A high magnetic moment material is deposited and a chemical mechanical polishing is performed to planarize the magnetic material and dielectric layer.


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