The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2011
Filed:
Jul. 22, 2010
Dong Sun Kim, Gyunggi-do, KR;
Taehoon Kim, Gyunggi-do, KR;
Jong Seok Song, Seoul, KR;
Sam Jin Her, Gyunggi-do, KR;
Jun Heyoung Park, Gyunggi-do, KR;
Dong Sun Kim, Gyunggi-do, KR;
Taehoon Kim, Gyunggi-do, KR;
Jong Seok Song, Seoul, KR;
Sam Jin Her, Gyunggi-do, KR;
Jun Heyoung Park, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating material; forming in the insulating material at least one via-hole for interlayer electrical connection; ion beam treating the surface of the insulating material having the via-hole formed therein; forming a copper seed layer on the surface-treated insulating material using a vacuum deposition process; and plating a copper pattern on the copper seed layer to form a circuit pattern.