The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2011
Filed:
Sep. 05, 2007
Ryoichi Watanabe, Suwon-si, KR;
Byoung-youl Min, Seongnam-si, KR;
Je-gwang Yoo, Yongin-si, KR;
Joon-sung Kim, Suwon-si, KR;
Seung-chul Kim, Cheongiu-si, KR;
Myung-san Kang, Suwon-si, KR;
Ryoichi Watanabe, Suwon-si, KR;
Byoung-Youl Min, Seongnam-si, KR;
Je-Gwang Yoo, Yongin-si, KR;
Joon-Sung Kim, Suwon-si, KR;
Seung-Chul Kim, Cheongiu-si, KR;
Myung-San Kang, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method of fabricating a printed circuit board is disclosed. A method of fabricating a printed circuit board that includes: stacking an insulation layer on at least one surface of a core layer, on which an inner circuit is formed, and forming an outer circuit pattern; burying the outer circuit pattern in the insulation layer; removing the outer circuit pattern to form minute grooves and curing the insulation layer; and forming an outer circuit by filling metal in the minute grooves, makes it possible to readily form high-resolution fine-line circuits, as well as to reduce fabrication costs and increase productivity.