The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2011

Filed:

Jan. 25, 2010
Applicants:

Yasuyuki Bessho, Uji, JP;

Hiroki Ohbo, Hirakata, JP;

Kunio Takeuchi, Joyo, JP;

Seiichi Tokunaga, Toyonaka, JP;

Yasumitsu Kunoh, Tottori, JP;

Masayuki Hata, Takatsuki, JP;

Inventors:

Yasuyuki Bessho, Uji, JP;

Hiroki Ohbo, Hirakata, JP;

Kunio Takeuchi, Joyo, JP;

Seiichi Tokunaga, Toyonaka, JP;

Yasumitsu Kunoh, Tottori, JP;

Masayuki Hata, Takatsuki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a semiconductor laser device comprises steps of forming a first semiconductor laser device substrate having first grooves for cleavage on a surface thereof, bonding a second semiconductor laser device substrate onto the surface side having the first grooves and thereafter cleaving the first and second semiconductor laser device substrates along at least the first grooves.


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