The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2011

Filed:

Sep. 19, 2008
Applicants:

Masami Motegi, Gunma, JP;

Masashi Terauchi, Gunma, JP;

Takashi Higo, Gunma, JP;

Inventors:

Masami Motegi, Gunma, JP;

Masashi Terauchi, Gunma, JP;

Takashi Higo, Gunma, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a hybrid integrated circuit device that uses a metal substrate, a sound noise is prevented, which would otherwise be generated due to transmission, to the metal substrate, of vibration caused when a ceramic capacitor expands and contracts by switching ON and OFF a transistor. For improving a heat dissipation effect, a switching transistor driven by a driving pulse and a ceramic capacitor connected to the switching transistor are incorporated on a conductive path on an insulated metal substrate. Both ends of the ceramic capacitor are fixed to the conductive path by solders which are covered with a hard resin to be protected from a solder crack by thermal expansion of the metal substrate. The ceramic capacitor and the hard resin are wholly covered with a soft resin which absorbs noise due to expansion caused when the ceramic capacitor is switched, so that the metal substrate is prevented from resonating.


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