The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2011
Filed:
Aug. 29, 2007
Hirotada Furukawa, Tokyo, JP;
Toshiaki Kikuchi, Tokyo, JP;
Yutaka Sato, Tokyo, JP;
Takaaki Domon, Tokyo, JP;
Yoshio Kaita, Tokyo, JP;
Hirotada Furukawa, Tokyo, JP;
Toshiaki Kikuchi, Tokyo, JP;
Yutaka Sato, Tokyo, JP;
Takaaki Domon, Tokyo, JP;
Yoshio Kaita, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
An electronic component module is configured by a passive component mounted on a built-in IC substrate. The passive component is provided with a passive element inductor, and a mounting surface for mounting on a substrate. Concavities are respectively provided at parts of two opposed borders in the mounting surface, and a terminal electrode is provided at the bottom part of the concavities. Since the passive component has a concavity within the mounting surface and the terminal electrode is incorporated within this concavity, the passive component can be mounted low on the substrate surface. Since the terminal electrode is incorporated in the concavity, solder is prevented from spreading fillet-like at the periphery of the inductor, thus increasing the mounting density of the passive component. There is increased freedom for mounting the passive component because the passive component is mounted on the built-in IC substrate in which the IC is embedded in the substrate.