The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2011
Filed:
Nov. 30, 2004
Hidetsugu Motobe, Fukuyamamachi, JP;
Yoshihiko Nakamura, Sukagawa, JP;
Takeshi Koizumi, Asaka-machi, JP;
Ryuji Takahashi, Fukushima, JP;
Hidetsugu Motobe, Fukuyamamachi, JP;
Yoshihiko Nakamura, Sukagawa, JP;
Takeshi Koizumi, Asaka-machi, JP;
Ryuji Takahashi, Fukushima, JP;
Matsushita Electric Works, Ltd., Osaka, JP;
Abstract
An epoxy resin composition for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, is provided. The composition features: (A) a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule; (B) a reaction product of a phosphorous compound, a bifunctional epoxy resin, and an optional multifunctional epoxy resin, provided in an amount of 20% to 55% by mass, based on the total amount of epoxy resin, including (A) and (B); (C) a curing agent of dicyandiamide and/or a multifunctional phenolic compound; and (D) an inorganic filler blend containing an inorganic filler with a thermal decomposition temperature of 400° C. or above. The composition does not generate toxic substances when combusted and has excellent ignition resistance, solder heat resistance after moisture absorption, and high temperature rigidity.