The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2011

Filed:

Dec. 19, 2007
Applicants:

Wei Liu, San Jose, CA (US);

Johanes F. Swenberg, Los Gatos, CA (US);

Hanh D. Nguyen, San Jose, CA (US);

Son T. Nguyen, San Jose, CA (US);

Roger Curtis, Stockton, CA (US);

Philip A. Bottini, Santa Clara, CA (US);

Inventors:

Wei Liu, San Jose, CA (US);

Johanes F. Swenberg, Los Gatos, CA (US);

Hanh D. Nguyen, San Jose, CA (US);

Son T. Nguyen, San Jose, CA (US);

Roger Curtis, Stockton, CA (US);

Philip A. Bottini, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention generally provides apparatus and method for adjusting plasma density distribution in an inductively coupled plasma chamber. One embodiment of the present invention provides an apparatus configured for processing a substrate. The apparatus comprises a chamber body defining a process volume configured to process the substrate therein, and a coil assembly coupled to the chamber body outside the process volume, wherein the coil assembly comprises a coil mounting plate, a first coil antenna mounted on the coil mounting plate, and a coil adjusting mechanism configured to adjust the alignment of the first coil antenna relative to the process volume.


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