The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2011

Filed:

Dec. 14, 2010
Applicants:

Seung Hyun Cho, Seoul, KR;

Byoung Youl Min, Gyunggi-do, KR;

Soon Jin Cho, Gyunggi-do, KR;

Jin Won Choi, Gyunggi-do, KR;

Inventors:

Seung Hyun Cho, Seoul, KR;

Byoung Youl Min, Gyunggi-do, KR;

Soon Jin Cho, Gyunggi-do, KR;

Jin Won Choi, Gyunggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/44 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.


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