The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2011
Filed:
May. 28, 2009
Lawrence W. Tiffin, Vail, AZ (US);
Lawrence W. Tiffin, Vail, AZ (US);
Raytheon Company, Waltham, MA (US);
Abstract
A circuit module may include a first substrate having a first side and a second side, a second substrate having a third side and a fourth side, the third side facing the second side, and a resilient bond layer coupling the second side to the third side. The first substrate may have a first coefficient of thermal expansion and the second substrate may have a second coefficient of thermal expansion substantially different from the first coefficient of thermal expansion. A broadside coupler may couple a microwave signal from the first substrate to the second substrate. The broadside coupler may include a first conductive element formed on the second side and a second conductive element formed on the third side proximate the first conductive element.